AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke ...

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...

Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, ...

Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride ...

Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need ...

“The truthfulness or reliability of the data, which refers to the data quality and the data value. Big data must not only be ...