AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke ...

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...

Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

Critical minerals our world needs for electric vehicles and semiconductors can be found here. Clean energy we need to power ...

The second blog was “Three Ways Curvy ILT Together with PLDC Improves Wafer Uniformity,” from April 18, 2025. In 2024, the ...

Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride ...

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

The choice of DRAM depends on where the action is.