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十轮网科技资讯 on MSN
50 分钟
LG Innotek推出铜柱封装技术, 新基板技术将彻底改变产业格局
LG Innotek近期发布一项突破性芯片封装方案,采“铜柱”(Copper Posts)技术,取代传统仅使用锡球(solder balls)连接芯片基板与主板的方式,让智能手机朝向更轻薄与高性能发展。
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