AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was ...

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...

While line dimensions are large by die standards, they’re small by PCB standards. “The minimum solution is a 2µm line width ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride ...

Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

“The truthfulness or reliability of the data, which refers to the data quality and the data value. Big data must not only be ...

The choice of DRAM depends on where the action is.