AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke ...

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was ...

However, many types of defects, including many macro defects, only occur intermittently. These are frequently missed by sampling. And when they are not flagged in time, they can be covered over by ...

The second blog was “Three Ways Curvy ILT Together with PLDC Improves Wafer Uniformity,” from April 18, 2025. In 2024, the ...

While line dimensions are large by die standards, they’re small by PCB standards. “The minimum solution is a 2µm line width ...

Time efficiency of analysis is especially critical when investigating quality excursions. During this time, the line may be ...

Bridging the gap between top-down and bottom-up approaches can enable organizations to create a dynamic and engaged workforce ...

Overseeing greenhouse gas emissions reduction in line with the science-based targets (SBTs), including a strategy to ...

A new technical paper titled “Topological Flat-Band-Driven Metallic Thermoelectricity” was published by researchers at TU ...

On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices” was published by researchers at IBM Research-Europe. Abstract “Analog in-memory computing is an emerging paradigm ...

A new technical paper titled “Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs” ...